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X11SPI-TF
MBD-X11SPI-TF-B
Product Highlights
1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP 2. Intel® C622 3. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots 4. Expansion slots: 1 PCIe 3.0 x16, 1 PCIe 3.0 x16 (x16 || x8), 1 PCIe 3.0 x8 (x0 || x8), 1 PCIe 3.0 x8, 1 PCIe 3.0 x4 (in x8) 5. M.2 NGFF connector M.2 Interface: PCIe 3.0 x4 and SATA Form Factor: 2280, 22110 Key: M-Key 6. 2 10GbE LAN ports 7. 10 SATA3 (6Gbps) via C622 8. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers) 9. I/O: 1 VGA, 2 COM, TPM header
Product Detail
Supermicro X11SPI-TF Motherboard
1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP 2. Intel® C622 3. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots 4. Expansion slots: 1 PCIe 3.0 x16, 1 PCIe 3.0 x16 (x16 || x8), 1 PCIe 3.0 x8 (x0 || x8), 1 PCIe 3.0 x8, 1 PCIe 3.0 x4 (in x8) 5. M.2 NGFF connector M.2 Interface: PCIe 3.0 x4 and SATA Form Factor: 2280, 22110 Key: M-Key 6. 2 10GbE LAN ports 7. 10 SATA3 (6Gbps) via C622 8. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers) 9. I/O: 1 VGA, 2 COM, TPM header